Method and system for preparing wireless communication chips for later processing

ABSTRACT

A method for manufacturing wireless communication devices for use in tracking or identifying other items comprises a number of cutting techniques that allow the size of the antenna for the wireless communication device. Further, the chip for the wireless communication device is nested so as to be flush with the surface of the substrate of the wireless communication device. Rollers cut the tabs that form the antenna elements. In a first embodiment, a plurality of rollers is used, each one effecting a different cut whose position may be phased so as to shorten or lengthen the antenna element. In a second embodiment, the rollers are independently positionable to shorten or lengthen the antenna element.

CROSS-REFERENCES TO RELATED APPLICATIONS

This application is a divisional of U.S. patent application Ser. No.12/558,406, filed Sep. 11, 2009, which is a divisional of U.S. patentapplication Ser. No. 11/468,756, filed Aug. 30, 2006, now U.S. Pat. No.7,650,683, which is a divisional of U.S. patent application Ser. No.10/422,616, filed Apr. 24, 2003, now U.S. Pat. No. 7,191,507, whichclaims the benefit of U.S. Provisional Patent Application No.60/375,249, filed Apr. 24, 2002, the disclosures of which areincorporated by reference herein in their entirety.

BACKGROUND

The present disclosure relates to a method of manufacturing a wirelesscommunication device for use in communication of information concerningan item containing the wireless communication device.

It is often desired to track and identify items, such as packages,containers, and the like, and to communicate information concerning suchitems wirelessly. One method of tracking and providing informationconcerning packages is to attach a wireless communication device, suchas a radio frequency identification (RFID) transponder or otheridentification device, to packages or items. The informationcommunicated concerning the packages or items may include an expirationdate, “born on” date, or date of manufacture, lot number, trackinginformation, or other manufacturing information, and the like. Awireless communication device may be attached to an individual package,to a container containing multiple packages, or other item as thesituation merits.

Recent advances in the miniaturization of wireless communicationelectronics have enabled the creation of small chips containingintegrated circuits that are well suited for use in these wirelesscommunication devices. However, these chips still need antennas tocommunicate to a remotely positioned interrogator. Numerous potentialantennas exist that may be coupled to the chip for this purpose.

It is expected that the demand for such devices will rapidly increase asindustries realize the versatility and utility of the wirelesscommunication devices. To meet this demand, automated manufacturingprocesses are needed. Further, the process contemplated should provide awireless communication device well suited for integration with the itemto be tracked and one that may have the ability to communicate atmultiple frequencies if desired.

SUMMARY

This summary is provided to introduce a selection of concepts in asimplified form that are further described below in the DetailedDescription. This summary is not intended to identify key features ofthe claimed subject matter, nor is it intended to be used as an aid indetermining the scope of the claimed subject matter.

In a first aspect, the present disclosure provides a number ofembodiments designed to pick up chips from a carrier tape and positionthe chips on an adhesive production line for later incorporation into awireless communication device.

A second aspect that may be used in conjunction with the first aspectcomprises a combination of positioning a conductive material on a roll,cutting the conductive material to the desired shape, and peeling theconductive material from an underlying carrier material. In oneembodiment of this aspect, a single roller performs the entire cut. In asecond embodiment of this aspect, three separate rollers performdifferent cuts, allowing the size of the tabs created to be varied asneeded or desired.

Another aspect comprises using two selectively spaced rollers to adjustthe size of the tab created. In an exemplary embodiment, a testingdevice may assess the capacitance of the elements of the dipole with aground layer or without a ground layer to give an estimate of thethickness and/or dielectric constant of the substrate to which the chipis being applied. Each roller may be moved independently, increasing ordecreasing the size of the tab while assessing the effective capacitanceuntil a desired value is achieved for maximum antenna performance. Uponreaching the desired values, the tabs are cut to create the antenna.

As yet another aspect of the present disclosure, a wirelesscommunication chip may be inserted into a substrate such that the chipdoes not protrude from the surface of the substrate. An exemplaryembodiment includes punching a hole in the substrate, positioning tabsto form a dipole antenna overlapping the newly formed hole, andpositioning the chip in the hole. The chip may be attached to the tabsby a low melting point solder, a conductive adhesive, welding, or amechanical bond.

The aspects are mutually cooperative and allow a roll-to-rollmanufacturing process to be automated for the creation of the wirelesscommunication devices.

DESCRIPTION OF THE DRAWINGS

The foregoing aspects and many of the attendant advantages of thisdisclosure will become more readily appreciated as the same becomebetter understood by reference to the following detailed description,when taken in conjunction with the accompanying drawings, wherein:

FIG. 1 illustrates a top plan view of a wireless communication deviceassembled according to the present disclosure;

FIG. 2 illustrates a side elevational view of a carrier tape loaded withwireless communication chips;

FIG. 3 illustrates a side schematic view of a first technique toposition chips on an adhesive production line;

FIG. 4 illustrates a side schematic view of a second technique toposition chips on an adhesive production line;

FIG. 5 illustrates a more detailed view of the interface between theroller and the carrier tape of FIG. 4;

FIG. 6 illustrates a side view of a first cutting technique for creatingantenna elements for wireless communication devices;

FIG. 7 illustrates a top view of the first cutting technique of FIG. 6;

FIG. 8 illustrates a side view of a second cutting technique forcreating antenna elements for wireless communication devices;

FIG. 9 illustrates a top view of a laminate during different stages ofthe cutting of FIG. 8;

FIG. 10 illustrates a side view of a third cutting technique forcreating antenna elements for wireless communication devices;

FIG. 11 illustrates a top view of the third cutting technique of FIG.10;

FIG. 12 illustrates a top view of the third cutting technique of FIG. 10with the rollers spread;

FIGS. 13A and 13B illustrate top views of the tape before and aftercutting in the process of FIGS. 10-12;

FIG. 14 illustrates a first cross-sectional view of a positioningtechnique for a chip to be used in a wireless communication device;

FIG. 15 illustrates a top plan view of an antenna element positioned ona substrate;

FIG. 16 illustrates a side view of the antenna element of FIG. 15 with achip positioned above it prior to positioning;

FIG. 17 illustrates a side view of the antenna element of FIG. 16 withthe chip positioned;

FIG. 18 illustrates an exemplary roller technique to attach the chips tothe substrate of the wireless communication device;

FIG. 19 illustrates a more detailed view of the chip being attached tothe substrate; and

FIG. 20 illustrates an exemplary block diagram of an entire productionprocess using the techniques of the present disclosure.

DETAILED DESCRIPTION

The present disclosure provides a method of manufacturing wirelesscommunication devices such as those used in co-pending, commonlyassigned U.S. patent applications Ser. Nos. 09/678,271 and 09/678,630,now U.S. Pat. Nos. 6,501,435 and 6,975,834, entitled “WirelessCommunication Device and Method” and “Mufti-Band Wireless CommunicationDevice and Method,” respectively, both of which were filed on Oct. 3,2000, and are incorporated herein by reference in their entireties. Inparticular, the present disclosure allows variations in the size of thetabs used for antenna elements in the wireless communication devices.

Some wireless communications devices have both transmit and receivecapability and can be used with the present disclosure. A typicalexample of such a device is described in U.S. Pat. No. 5,585,953,entitled “IR/RF Radio Transceiver and Method,” incorporated herein byreference in its entirety. Other wireless communication devices havereceive capability and use the energy received to communicate back, suchas described in U.S. Pat. No. 6,078,259, entitled “Radio FrequencyIdentification Tag,” incorporated herein by reference in its entirety.Such passive devices may likewise be used with the present disclosure.The wireless communication device in the present disclosure can be anytype of device that allows reception of wireless electroniccommunications and is able to communicate in response thereto. Bothtypes of wireless communication devices are sometimes referred to hereinand in the art as transponders. The terms are used equivalently herein.

FIG. 1 illustrates a wireless communication device 10, such as thatdescribed in the previously incorporated applications. In particular;wireless communication device 10 comprises a substrate 20, a wirelesscommunication chip 30, and one or more tabs 40 to serve as an antenna 60for wireless communication device 10. Tabs 40A, 40B may be constructedout of any type of material so long as the material is conductive. Suchmaterial may be a ferrous material, including metal, steel, iron, or thematerial may be aluminum or other type of conducting material.

Tabs 40 may also be constructed from a tape impregnated with metalloaded ink, as described in U.S. Pat. No. 5,566,441, entitled “Attachingan Electronic Circuit to a Substrate,” incorporated herein by referencein its entirety. In one embodiment of the present disclosure, asillustrated in FIG. 1, tabs 40A, 40B are made from a foil tape 42, 52,respectively, as is well understood in the art.

An optional ground plane (not shown) may be oppositely positioned onsubstrate 20 if needed or desired. Substrate 20 may be almost anymaterial, but is most likely a plastic or similar material.

Wireless communication chip 30 may comprise a device from INTERMEC asused in their INTELLITAG® labels and those devices from SOS as used intheir DL 100 label, although other devices are certainly possible,especially in light of the present disclosure's suitability to bothactive and passive wireless communication devices 10. Wirelesscommunication chip 30 may comprise a controller, memory, a battery, asensor, and other conventional components, such as those described inthe previously incorporated applications.

Tabs 40A, 40B together comprise dipole antenna 60. In this particularembodiment, tabs 40A, 40B are asymmetrical with respect to one anotherto form an asymmetrical dipole antenna. An asymmetrical dipole antenna60 is an antenna having a first tab 40A or first pole, different inshape, including, but not necessarily limited to length, width, volume,and/or density, from the second tab 40B, or second pole.

Tabs 40A, 40B may also be coupled to a slot to form a slot antenna (notshown). Alternatively, a single tab 40 may be used as a monopole antennagiven the appropriate ground plane (not shown). While the presentdisclosure is primarily directed to dipole antenna tab structures, itshould be appreciated by those in the art that some of the techniquesmay be equally applicable to a single tab 40 arrangement or anarrangement having more than two tabs 40A, 40B.

The present disclosure focuses on techniques to manufacture thesewireless communication devices 10. There are several different aspectsto the manufacturing process. The first is properly positioning thewireless communication chip 30 for later processing and is discussed inthe chip-positioning section below. The second is the creation of thetabs 40 that form the antenna 60, are addressed in a separate sectionbelow. The last is the merging of the chip 30 with the antenna 60 toform the wireless communication device 10, discussed in the mountingtechniques section below.

CHIP POSITIONING TECHNIQUES

FIG. 2 illustrates an exemplary carrier tape 100 comprising an adhesivesealing layer 102 and a container layer 104. Container layer 104comprises a plurality of containers or pockets 106 having wirelesscommunication chips 30 disposed therein. Carrier tape 100 may be madefrom any number of materials and is available from a number ofmanufacturers, such as Tek Pak. Details can be found at www.tekpak.com.Adhesive sealing layer 102 initially seals the chips 30 within thecontainers 106, protecting them from environmental vagaries.Subsequently, when desired, adhesive sealing layer 102 peels off ofcontainer layer 104, leaving the contents of the containers 106 exposedfor further processing.

There are two specifically-contemplated techniques to remove the chips30 from the carrier tape 100 for later mounting on the wirelesscommunication device 10. Other techniques are also contemplated toenable the roll-to-roll continuous automation process of the presentdisclosure.

A first technique is illustrated in FIG. 3. Chip positioning system 110comprises a waste roller 112, a first roller 114, and a second roller116. Carrier tape 100 is fed to rollers 114, 116 simultaneously with anadhesive line 118. Waste roller 112 wraps adhesive sealing layer 102therearound, exposing chips 30 within the containers 106 (FIG. 1).Rollers 114, 116 may be oval shaped and rotate at a frequency so as tospace chips 30 appropriately on adhesive line 118. The proximity of theroller 114 to roller 116 pushes the chip 30 out of the container 106 andto the sticky surface of the adhesive line 118. This removes the chip 30from the container 106 and allows the adhesive line 118 with the chips30 to be passed downstream for further processing.

A second technique is illustrated in FIGS. 4 and 5. As illustrated inFIG. 4, chip positioning system 110A comprises a waste roller 112, atoothed roller 120 having teeth 122 and may have an optional secondroller (not shown) comparable to second roller 116. Carrier tape 100 isfed to the roller 120 with waste roller 112 removing the adhesivesealing layer 102 as previously described. Now with reference to FIG. 5,wherein a more detailed view of the interface between the teeth 122, thecontainers 106, the chips 30, and the adhesive line 118 is illustrated,it can be seen that a tooth 122 pushes through the floor 105 of thecontainer 106, pushing chip 30 upwardly to contact the adhesive line118. Again, this removes the chip 30 from the container 106 and allowsthe adhesive line 118 with the chips 30 to be passed downstream forfurther processing.

MANUFACTURE OF TABS FOR ANTENNA

Concurrent to the positioning of the chips 30 on the adhesive line 118,tabs 40 may be created for the wireless communication device 10. Thissection focuses on techniques by which the tabs 40 may be created thatare again well suited for use in the roll-to-roll automatedmanufacturing process of the present disclosure.

A first technique for the creation of tabs 40A, 40B is illustrated inFIGS. 6 and 7. FIG. 6 illustrates a tab production system 130 comprisinga pair of rollers 132, 134 oppositely positioned on either side of aproduction line 140. Top roller 132 may comprise a die-cutting rollerwhile bottom roller 134 may be a driving roller to push material thoughrollers 132, 134. It should be appreciated that rollers 132, 134 may bereversed if production line 140 is inverted. Production line 140 mayalso comprise a backing layer 142, an adhesive (not shown explicitly)and a conductive foil 144, such as a copper foil, an aluminum foil, orthe like. As production line 140 passes through rollers 132, 134,die-cutting roller 132 cuts conductive foil 144 into one or more tabs40. In this particular embodiment, die-cutting roller 132 cutsconductive foil 144 into two tabs 40A, 40B. Waste foil 146 is peeledfrom backing layer 142 while tabs 40A, 40B and backing layer 142continue for further processing. Tabs 40 are then used to form antennaelements for antenna 60 on the wireless communication device 10 asexplained below.

To accommodate substrates 20 that may have varying dielectric constantsand/or thicknesses (such as may occur when switching materials havingdifferent dielectric constants forming substrate 20), variations mayneed to be made to the dimensions of tabs 40A, 40B to produce theoptimum read range at the desired operating frequency. To ensure optimalantenna 60 performance using tabs 40A, 40B with chip 30, energy transfershould be maximized between chip 30 and tabs 40A, 40B to maximizeemitted radiation from tabs 40A, 40B. To ensure maximum energy transfer,the impedance of tabs 40A, 40B must be substantially matched to theimpedance of chip 30.

Further information on impedance-matching between wireless communicationdevices and antennas is described in the previously incorporated U.S.patent application Ser. Nos. 09/678,271 and 09/678,630, and co-pendingU.S. patent application Ser. No. 10/125,786, entitled “Tuning Techniquesfor a Slot Antenna,” filed on Apr. 18, 2002, now U.S. Pat. No.6,642,897, filed by the same assignee as that of the present applicationand incorporated herein by reference in its entirety.

A first technique to address this situation is illustrated in FIGS. 8and 9. In this technique, a plurality of rollers 200, 202, 204 is used.In particular, tab production system 130A receives production line 140.A first roller 200 makes an initial cut 206 in conductive foil 144. Thisinitial cut 206 comprises the inner portions of tabs 40A, 40B. A secondroller 202 makes a second cut 208 in conductive foil 144 that completesthe creation of one of tabs 40A, 40B (in this case, tab 40A). Second cut208 overlaps to a certain extent initial cut 206 of first roller 200. Athird roller 204 makes a third cut 210 in conductive foil 144 thatcompletes the creation of the other one of tabs 40A, 40B (in this case,tab 40B). Third cut 210 overlaps to a certain extent the initial cut 206of first roller 200. Note that the precise order of the cutting byrollers 200, 202, 204 may be varied. For example, a first cut couldbegin on the left edge, beginning tab 40A, a second cut ends tab 40A andbegins tab 40B, and the third cut ends tab 40B. Other variations arealso contemplated.

The technique of FIGS. 8 and 9 allows the sizes of the tabs 40A, 40B tobe varied by varying the phases of rollers 202, 204 with respect tofirst roller 200. Thus, if a longer tab 40A is desired, second roller202 is phased such that there is little overlap between the cuts 206,208. If a shorter tab 40A is desired, second roller 202 is phased suchthat there is substantial overlap in the cuts 206, 208. The sameprinciple applies to the size of tab 40B, but the phase of third roller204 is modified to achieve the desired amount of overlap between thecuts 206, 210. Allowing for differently-sized tabs 40A, 40B allowsoptimal antenna 60 performance as previously explained. It should beappreciated that rollers 200, 202, 204 rotate at the same rate to avoidundesired phase changes between rollers 200, 202, 204. This technique isespecially well suited for situations in which substrate 20 variesbetween wireless communication devices 10. In one embodiment, it isexpected that at a 200 ft/min rate of movement of production line 120and an antenna 60 dimension of approximately 68 mm×16 mm outsidedimensions, thus giving about 60 antennas 60 per foot, approximately12,000 antennas may be made per minute.

An alternate technique to provide variations in the size of tabs 40A,40B is illustrated in FIGS. 10-13B. In this technique, production system130B comprises a first roller 300 and a second roller 302, each of whichis independently movable relative to one another. This technique isbetter suited for situations in which substrate 20 on which wirelesscommunication device 10 is to be placed varies, as this technique allowstesting on the fly to get the desired impedance for antenna 60 inconjunction with substrate 20. Rollers 300, 302 receive a productionline 140A (illustrated in FIG. 13A) comprising a backing material 130with tabs 40A, 40B and chip 30 disposed thereon. In contrast to theother techniques previously discussed, this technique positions, butdoes not specifically require, chip 30 mounted with the elements thatform tabs 40.

Production line 140A passes under first roller 300 and second roller 302to deposit the tabs 40 and the chip 30 onto the substrate 20. Rollers300 and 302 may initially be close together as illustrated by dimension‘X’ in FIGS. 10 and 11. During the deposit of tabs 40A, 40B on substrate20, a low signal level and low frequency radiator 138, operating at, forexample, 125 kHz, assesses the capacitance of tabs 40A, 40B inconjunction with substrate 20 and with or without ground plane 306 (FIG.10). This provides an estimate of the thickness and dielectric constantof substrate 20. Tabs 40A, 40B may be sized appropriately to provide thedesired capacitance by moving the rollers 300, 302 to insure optimalantenna 60 performance as previously discussed.

As illustrated by the difference between FIGS. 11 and 12, rollers 300,302 may be spread if larger tabs 40A, 40B are required. After thetesting equipment determines that the tabs 40 are appropriately sized togive the desired performance to antenna 60, a cut is made and tabs 40A,40B are mounted on substrate 20. This cut may be made with a die, aknife, a laser, or other appropriate cutting tools (none shown). It maybe desirable to test capacitance by changing one and then the other tab40A, 40B as needed or desired. As can be seen in FIG. 13B, the cutremoves tabs 40A, 40B and a portion of the backing material 130 tocreate hole 121, leaving tab residuals 40′, 50′.

As previously noted, some of the above techniques may be occurringconcurrently with the positioning of the chips 30 on the adhesive line118. The following section deals with mounting the chips 30 on thewireless communication device 10 after the antenna 60 has beenpositioned thereon.

MOUNTING TECHNIQUES

One technique is illustrated in FIG. 14. In particular, a hole 22 ispunched into substrate 20. Hole 22 is any type of cavity in substrate 20or any type of geometry such that wireless communication chip 30 may bewholly or partially placed inside such cavity. Hole 22 may have taperedtop edges 24 that taper from a wide opening 26 to a narrow mouth 28. Thesize of narrow mouth 28 may be the same or smaller in size than thewidth of wireless communication chip 30, so that wireless communicationchip 30 rests in hole 22 at the point where narrow mouth 28 begins.

Foil tape 42, 52 overlaps edges 24 so that tape 42, 52 extends partiallyinto hole 22. Chip 30 is then inserted in the direction of the arrowinto the hole 22. Hole 22 may be designed to allow chip 30 to sit flushwith upper surface 21 of substrate 20 without substantially protrudingtherefrom, as is illustrated in FIG. 14. This reduces the profile ofsubstrate 20 and protects chip 30 from some inadvertent harm. Hole 22may also be designed to allow chip 30 to sit fully below upper surface21 or to protrude slightly from hole 22, depending on the design andsize of hole 22, edges 24, and mouth 28.

A number of techniques exist to attach chip 30 to tabs 40A, 40B. Afirst, technique comprises using a low melting point solder. Tape ends44, 54 of foil tape 42, 52 may be pre-loaded with a solder paste. Chip30 is then simply dropped onto the paste (not shown), and the solder(not shown) is melted to form connectivity between tabs 40A, 40B andchip 30. Appropriate methods to form the solder joint comprise the useof infrared radiation to heat the joint locally, or pushing chip 30 intothe paste with pins 32 of chip 30 preheated. Preheating of pins 32allows the solder to remain in a liquefied state longer after initialmelting so that solder may more easily, flow to more surface area oftabs 40A, 40B and around pin 32 to form a stronger bond. Such preheatingmay be accomplished by any technique, including use of a preheating toolthat emits heat such as a hot gas jet or the like.

An alternative technique for attaching chip 30 to tabs 40A, 40Bcomprises the use of a conductive adhesive (not shown). The adhesiveforms a bond between tabs 40A, 40B and chip 30, and the conductivity ofthe adhesive ensures electrical continuity between tabs 40A, 40B andchip 30. Either a suitable conductive adhesive can be applied byprinting to ends 44, 54 of tape 42, 52 prior to assembly, or chip 30 maybe pushed onto a pressure sensitive conductive adhesive on top surfaces46, 56 of tape 42, 52. It may be advantageous, but not required to usean adhesive that can be cured rapidly. For example, an adhesive cured bya flash of ultraviolet (UV) light would be appropriate. Examples ofconductive adhesives include isotropic conductive adhesives, conductivesilicones, and anisotropic conductive adhesives. The interested readeris directed to “Electrically Conductive Adhesives Characteristics andApplications,” a Loctite Corporation publication available atwww.loctite.com that is hereby incorporated by reference in itsentirety. Further information may also be found at the following Website: www.chemical.felpro.com/electronics/elec_tech_index.html#eleccond.

Yet another alternative is illustrated in FIGS. 15-17. In thisembodiment, the tape 42 has one end sliced into a plurality of fingers48. Note that the fingers 48 are made from the same material as the tape42, but include cuts 49 between the fingers 48. The fingers are thenplaced proximate the hole 22. A top view of the tape 42, the fingers 48,and an exemplary positioning relative to the hole 22 is illustrated inFIG. 15. With that arrangement in place, it is now possible to mount thechip 30.

Chip 30, and particularly pins 32 thereof, are heated above the yieldpoint of substrate 20 and positioned over substrate 20 (FIG. 16). Pins32 are then forced into substrate 20 with fingers 48 wrapping aroundpins 32, as illustrated in FIG. 17. The heat of pins 32 melts substrate20, which then cools around tape 42 and pins 32, forming an effectivemechanical bond. Also note that this technique could also be done on theother tab 40B (not shown) in a similar fashion. Note that both tabs 40A,40B should be in place prior to this insertion.

Still another alternative would be to weld or tack pins 32 to tape 42,52 using a suitable tool. The tool presses chip 30 into surface 21 ofsubstrate 20. A high current may be passed through pins 32, using a lowvoltage pulse therethrough to form the weld. A lower voltage pulse isdesirable so as to not apply a damaging voltage to chip 30. A modifiedchip 30 with a single thin foil (not shown) rather than multiple pins 32may also be used for this technique. This technique may be better suitedfor chips 30 having an aluminum thin foil rather than a copper thinfoil, since aluminum has a melting point temperature lower than copper,thereby allowing use of a current that is lower in amperes.

With all of these embodiments, a sealing layer (not shown) may also beplaced onto substrate 20 and over chip 30 to hold chip 30 firmly in itsdesired location. This sealing layer may be an epoxy, but may instead bea robust plastic such as polyimide, Mylar, or polypropylene. Theseplastics may be attached by adhesives or by thermal welding as needed ordesired.

It should be noted that extra layers may be added to wirelesscommunication device 10 after or in place of the sealing layer. Forexample, a paper layer for printing or plastic layers may be added tothe structure. Such sealing layer or layers may be applied ontosubstrate 20 using any type of label printing machine.

For almost any of the above styled processes, the chip 30 may bepositioned on the substrate 20 with rollers as illustrated in FIGS. 18and 19. Chip merging system 160 is illustrated schematically in FIG. 18and comprises a first and second heat and pressure roller 162, 164.These rollers 162, 164 may perform the thermal welding alluded to above.Adhesive line 118 with chips 30 disposed thereon passes between rollers162, 164 and mates with substrate 20, and particularly, hole 22 ofsubstrate 20, as better seen in FIG. 19. Tabs 40 have beenpre-positioned on substrate 20 prior to the introduction of the chip 30thereto. Chip 30 may be secured to the tabs 40 and the substrate 20 byany of the means previously discussed as needed or desired.

The above-mentioned techniques are useful with a number of othermanufacturing techniques. Of particular interest is the creation of tabs40A, 40B. This may be done before, concurrently with, or after thecreation of hole 22 in substrate 20 as needed or desired.

The present disclosure is well suited for “roll-to-roll” processes,making the automation of the present disclosure easy. As illustrated inFIG. 20, the chip 30 positioning process may be occurring concurrentlywith the tab 40 creation process. The tabs are then positioned on thesubstrate 20 through an appropriate means as is well understood.Finally, the two production lines merge and the chip 30 may bepositioned on the substrate 20. Furthermore, the automation may test andmark defective parts as needed or desired.

The present disclosure may, of course, be carried out in other specificways than those herein set forth without departing from the scope andthe essential characteristics of the invention. The present embodimentsare therefore to be construed in all aspects as illustrative and notrestrictive and all changes coming within the meaning and equivalencyrange of the appended claims are intended to be embraced therein.

While illustrative embodiments have been illustrated and described, itwill be appreciated that various changes can be made therein withoutdeparting from the spirit and scope of the invention.

1. A method of preparing an antenna for use on a wireless communicationdevice, the method comprising: passing a metal foil through a pair ofrollers, wherein one of the pair of rollers is a die cut roller;die-cutting the metal foil with the die cut roller into a pair ofantenna tabs; and passing the antenna tabs downstream for securement toa substrate.
 2. The method of claim 1, wherein said passing the antennatabs downstream for securement to a substrate comprises passing theantenna tabs downstream to form an antenna on the wireless communicationdevice.
 3. The method of claim 1, further comprising determiningdimensions of the antenna tabs based on an electrical characteristic ofthe substrate.
 4. The method of claim 1, further comprising determiningthe dimensions of the antenna tabs based on a signal read range at adesired operating frequency.
 5. The method of claim 1, wherein saidpassing the antenna tabs downstream for securement to a substratecomprises: creating fingers on the antenna tabs; heating pins of awireless communication chip; and inserting the pins of the wirelesscommunication chip into the substrate such that the fingers on theantenna tabs wrap around the pins.
 6. The method of claim 1, whereinsaid passing the antenna tabs downstream for securement to a substratecomprises welding pins of a wireless communication chip to the antennatabs.
 7. The method of claim 6, wherein said welding pins of a wirelesscommunication chip to the antenna tabs comprises welding the pins of thewireless communication chip with a low voltage, high current electricalpulse.
 8. The method of claim 7, wherein said welding the pins of thewireless communication chip with a low voltage, high current electricalpulse comprises passing the low voltage, high current electrical pulsethrough the pins of the wireless communication chip.